MPi Parametric Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is extensively used on gold bump and pad wafer testing for Screen driver, logic, and memory device. MPI’s cantilever probes are definitely the corresponding reply to your requires of fi­ne pitch, smaller pad sizing, higher speed, a lot less cleansing, multi-DUT, high pin count, and ultra-reduced leakage specifications. With exceptional craftsmanship, impressive architecture and tested methodologies based on mechanical and electrical simulation/measurement outcomes, creating MPI the top cantilever company around the globe.


FCB Probe Card

The FCB Probe Card is easily the most experienced technological innovation of buckling beam probe card. It truly is aimed to attain the semiconductor ship manufacture time-to-marketplace (TTM) and cost of exam (COT) demand from customers. FCB is often a established Resolution for various semiconductor creation tests from early engineering pilot-operates to significant volume manufacturing (HVM). FCB is prepared for system requiring high sign integrity probing (SI) and/or electricity integrity probing (PI). Applications include slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB guarantees the entire world’s very best In general Charge-of-ownership (COO) for many DUT programs.


EVS Probe Card

The EVS Probe Card is definitely an improvement above the standard buckling beam probe card. Essential attributes are bigger existing carrying potential (C.C.C.) and decrease well balanced Make contact with drive (BCF), along with In general MEMS-like attributes. EVS can certainly satisfy the requirement of advanced wafer probing. Precise alignment and fantastic planarity Manage are definitely the crucial things contributing to stable Get hold of resistance. With its capacity and efficiency, EVS Probe Card is an excellent option for Sophisticated probe cards.


Osprey probe card

The Osprey probe card is MPI’s Alternative to demand for ever finer pitch. It can be suitable for smaller sized Al pad, and is also perfect for very small pitch software with peripheral and complete array pattern. With precise alignment and greater planarity Command, Osprey can reach read more increased efficiency by multi-DUT layout.  The forming wire (FW) form needle made with MPI’s own micro fabrication course of action not simply provides large-quality performance but additionally makes it possible for uncomplicated needle alternative and shortens retaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is provided with MEMS wire (MW) needle and that is created for the desire of lower pressure probing. Furthermore, it includes the chance to satisfy high C.C.C. and high pin counts software. The MEMS course of action makes certain hugely regular needle qualities, along with the Particular construction style permits exact alignment and planarity Handle.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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